MediaTek Dimensity 7050 launched, Lava Agni 2 to be the first phone to come with new processor – Times of India
Dimensity 7050 to debut in Lava Agni 2 5G
MediaTek also announced that Lava is India’s first original equipment manufacturer (OEM) that will incorporate MediaTek Dimensity 7050 SoC in the upcoming Lava Agni 2 5G smartphone.
“MediaTek has been collaborating with OEMs in India empowering incredible experiences supported by an extensive portfolio of smartphones and smart device technologies”, said Anku Jain, Managing Director, MediaTek India.
“MediaTek Dimensity 7050 will allow OEMs to create exceptional smartphones with greater CPU performance, low-power, and incredibly smooth game experience,” Jain added.
According to the company, MediaTek chips power nearly 2 billion connected devices a year.
MediaTek Dimensity 7050 specs
MediaTek said that the Dimensity 7050 is manufactured by 6nm fabrication process and comes with MediaTek 5G UltraSave for power efficiency.
“MediaTek Dimensity 7050 allows OEMs to create smartphones with greater CPU performance, low-power consumption, incredibly smooth gaming experience and allow the device makers to create attractive, slim and light 5G smartphones,” it said.
MediaTek HyperEngine: The MediaTek Dimensity 7050 comes with an integrated 5G HSR mode that will enable the smartphone to actively search and connect to the lowest latency available cell tower to minimise online ping.
Fast speeds: The SoC gets an Arm Mali-G68 graphics engine and the octa-core CPU featuring two Arm Cortex-A78 processors clocked up to 2.6GHz providing rapid app response and smooth gaming.
200MP photos & 4K HDR video: The Dimensity 7050 offers support for 200MP main camera, hardware-based camera engines and noise reduction techniques. There is also a 4K HDR video capture engine to record and stream video in all lighting conditions with minimal battery usage.
MediaTek MiraVision display: The chipset employs full HD+ displays up to 120Hz and comes with MediaTek Intelligent Refresh Rate Display technology.
Wi-Fi 6: The chipset offers Wi-Fi 6 with 2×2 MIMO support for faster, more reliable internet connections. Other connectivity technologies include Bluetooth 5 and GNSS.
MediaTek 5G UltraSave, dual 5G SIM: The Dimensity 7050 gets an integrated advanced 5G modem and in combination with MediaTek 5G UltraSave, it offers more 5G power-savings to the chip, MediaTek said.
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