Amkor is set to build a $2B advanced packaging and test facility in Peoria, Arizona.The facility will be the US’s largest outsourced advanced packaging facility, covering 55 acres with over 500,000 square feet of cleanroom space.
Apple and Amkor have been collaborating for over a decade, packaging chips that are extensively used in all Apple products. Both companies share a desire to manufacture in the U.S., and they have developed plans to build the largest outsourced advanced packaging facility in America. Approximately $2 billion will be invested in the project by Amkor, and upon completion, more than 2,000 people will be employed.
The plant’s first phase is targeted to be ready within two to three years, producing high-volume, advanced packaging and testing technologies for semiconductors in critical markets like high-performance computing, automotive, and communications.
Amkor states that it has collaborated extensively with Apple to develop the Peoria facility’s strategic vision and initial manufacturing capabilities. This facility will be responsible for packaging and testing chips produced for Apple at the nearby TSMC fab. Notably, Apple will be this new facility’s primary and largest customer upon its launch.
The investments in advanced manufacturing are part of the commitment that Apple has made to invest $430 billion in the U.S. economy over five years. Apple states that it is on track to achieve its target through direct spending with American suppliers, data centre investments, capital expenditures in the US, and another domestic spending.
Jeff Williams, Apple’s Chief Operating Officer, stated, “Apple is deeply committed to the future of American manufacturing, and we’ll continue to expand our investment here in the United States. Apple silicon has unlocked new levels of performance for our users, enabling them to do things they could never do before, and we are thrilled that Apple silicon will soon be produced and packaged in Arizona.”
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